Auto laser marking machine
Automatic Unwinding & Rewinding | High-Precision UV / Fiber Source | 24 h Continuous Production
Auto laser marking machine
Automatic Unwinding & Rewinding | High-Precision UV / Fiber Source | 24 h Continuous Production
其他信息
Automatic Unwinding & Rewinding | High-Precision UV / Fiber Source | 24 h Continuous Production
Engineered for wafer-level packaging, FPC circuits, RFID inlays and other reel-to-reel micro-components, this laser marker integrates automatic unwind / rewind, vision alignment and traceability data upload in one compact cell. The system prints crisp 2D codes, serial numbers or logos in areas as small as 0.2 × 0.2 mm, guaranteeing reliable identification throughout the semiconductor supply chain.
2. Key Performance Highlights
| Feature | Benefit |
|---|---|
| Dual-Laser Architecture | Standard 355 nm UV 5 W (fine surfaces) | Optional 1064 nm Fiber 20 W (metal foils) for multi-material processing |
| Closed-Loop Roll Handling | Tension 0.3–1.5 kgf, ±3 mm auto web guide; supports 8–56 mm carrier widths (≤ 120 mm customizable) |
| HD Vision Alignment | 5 MP camera, ±0.01 mm placement accuracy; auto compensation for web stretch & pitch variation |
| Ultra-Fast Galvo | Up to 7 000 mm/s, 0.01 mm line width, ±0.002 mm repeatability |
| Smart Software Suite | Built-in variable database, 1D/2D code generator, MES/ERP API, one-click batch changeover |
| Industrial Safety | Complies with Class 4 laser standards; optional full enclosure & fume extraction |
3. Technical Specifications
| Item | Value |
|---|---|
| Laser Power | UV 3 W / 5 W (std) | Fiber 20 W (opt) |
| Wavelength | 355 nm | 1064 nm |
| Marking Field | 110 × 110 mm (std) | 70 × 70 / 150 × 150 mm (opt) |
| Max Scan Speed | ≤ 7 000 mm/s |
| Min Character Height | 0.3 mm |
| Absolute Accuracy | ±0.01 mm |
| Repeatability | ±0.002 mm |
| Web Width | 8–56 mm (≤ 120 mm on request) |
| Core Diameter | 3 in (76 mm) std; 1 in / 6 in opt |
| Tension Range | 0.3–1.5 kgf |
| Vision Resolution | 0.005 mm/px |
| Interfaces | TCP/IP, OPC UA, RS-485, USB |
| Cooling | 1 kW industrial chiller (incl.) |
| Power Supply | AC 220 V ±10 %, 50/60 Hz, 1.5 kW |
| Machine Size / Weight | 1200 × 900 × 1600 mm / ≈ 450 kg |
| Operating Environment | 18–28 °C, ≤ 60 % RH (non-condensing) |
4. Typical Applications
-
Wafer-diced single chip 2D code marking
-
Batch coding on FPC / flexible PCBs
-
Serialisation of RFID & NFC tape-mounted tags
-
Traceable marking of MEMS microphones, buzzers & other micro-electronic parts
-
Any precision roll-format component requiring permanent, high-contrast ID
5. Optional Modules & Customisation
-
Twin-Laser Platform — UV + Fiber share one line for mixed-material runs
-
Inline AOI — post-mark inspection with automatic bad-mark removal
-
Full Safety Enclosure — laser-tight housing for higher class cleanrooms
-
Auto Splice Cart — fast roll exchange to cut downtime
-
Private Cloud Gateway — real-time yield & batch data pushed to your MES / ERP
